SÜSS MicroTec Launches XBC300 Gen2: A Versatile Hybrid Bonding Platform

SÜSS MicroTec SE has introduced the XBC300 Gen2 D2W/W2W, a flexible platform that combines wafer-to-wafer (W2W) and die-to-wafer (D2W) hybrid bonding technologies. This system, which works with both 200 mm and 300 mm substrates, facilitates the parallel development of various hybrid bonding processes. The XBC300 Gen2 is designed to conserve up to 40 percent of the space required by separate W2W or D2W bonders.

The integration of these technologies into a single platform makes it an especially efficient tool for research and development sectors in the semiconductor industry. It simplifies the testing and optimization of hybrid bonding methods for mass production. Notably, the device features contributions from SET Corporation SA, including an ultra-high-precision die bonder. This cooperation marks a significant advance in SÜSS MicroTec's product offerings, further broadening its hybrid bonding portfolio.

Hybrid bonding is pivotal for 3D chip integration, enhancing chip performance crucial for applications in high-performance computing, autonomous driving, and the expansion of 5G technology. SÜSS MicroTec's new platform aims to streamline the process selection, providing a versatile tool to establish optimal bonding procedures for various applications before committing to large-scale production.