Schweizer Electronic AG and Zollner Elektronik AG Announce Strategic Partnership

Schweizer Electronic AG (SCHWEIZER) and Zollner Elektronik AG (Zollner) have formed a strategic partnership in the field of power embedding. The collaboration aims to innovate through the use of SCHWEIZER's p² Pack® embedding technology. The partnership targets multiple applications and markets, particularly in the industrial and automotive sectors.

The p² Pack® technology integrates SiC chips directly into printed circuit boards, enhancing power switching applications, notably in DC to AC conversion systems. These systems face increasing demands for high energy efficiency, reliability, and longevity. The partnership will enable broader access to this technology, driving efficiency and environmental benefits.

Both companies see significant growth potential. SCHWEIZER will lend its expertise in PCB and chip embedding technologies, while Zollner will apply its application knowledge to support customers transitioning to embedding designs. This synergy is expected to foster innovation and expand their customer base.

The partnership aligns with the broader goal of achieving a CO2-neutral world and an All-Electric Society. Innovations, like high power densities and reduced system costs, are crucial for this transition. The collaboration underscores the necessity of joint efforts in attaining sustainable energy efficiency.

CEO Nicolas-Fabian Schweizer of SCHWEIZER and CEO Ludwig Zollner of Zollner expressed optimism about the benefits this partnership will bring to their respective companies and customers. By combining forces, they aim to offer enhanced services and drive technological advancements in the industry.