Onto Innovation and LPKF Speed Up Glass Core Substrate Production

Onto Innovation and LPKF Laser & Electronics AG have announced a partnership to accelerate the mass production of glass core substrates for semiconductors. LPKF has joined Onto Innovation's Packaging Applications Center of Excellence (PACE), a collaborative effort aimed at developing seamless process integration and a secure supply chain for panel-level packaging based on glass cores. These substrates are increasingly vital for applications in high-performance computing, AI, cloud computing, and machine learning.

As part of the collaboration, Onto Innovation will install its state-of-the-art Firefly® system in LPKF's glass processing facility in Hanover, Germany. This integration aims to enhance process and supply chain readiness for high-volume manufacturing, ensuring efficient and high-yield production of advanced glass substrates. The partnership between Onto and LPKF highlights an important step toward improving production quality in the semiconductor industry.